Hybrid Conference (In Person / Virtual)

International Conference on Thermal Interface Materials and Applications (ICTIMA - 27)
4th - 5th March 2027 , Natal, Brazil
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Call For Papers

The ICTIMA provides a supportive platform for both experienced researchers and early-career academicians to present their work and gain recognition.

The conference covers diverse topics such as Heat Transfer, encouraging participation from emerging researchers and fostering academic growth.

Authors are invited to submit papers addressing, but not limited to, the following areas:

01
Properties of thermal interface materials
02
Applications of TIMs in electronics cooling
03
Characterization techniques for TIM performance
04
Thermal conductivity measurement methods
05
Innovative materials for thermal management
06
Impact of surface roughness on TIMs
07
Thermal interface materials in automotive applications
08
Modeling heat transfer in TIMs
09
Durability and reliability of TIMs
10
Thermal performance of adhesive materials
11
TIMs for high-power electronic devices
12
Nanomaterials in thermal interface applications
13
Heat transfer enhancement with TIMs
14
Thermal cycling effects on TIM performance
15
Future trends in thermal interface materials
16
TIMs in aerospace applications
17
Thermal management in wearable technology
18
Advanced coatings for thermal interfaces
19
Sustainability in thermal interface materials
20
Challenges in TIM integration and design

Assessment

Submissions will be reviewed to ensure quality and relevance, with a focus on encouraging emerging research contributions. Accepted papers will be presented and considered for publication opportunities.

Registration

Early-career researchers are encouraged to register and present their work, gaining valuable feedback and academic exposure.

Publication

The conference provides opportunities for emerging researchers to publish their work in recognized platforms.