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Maximum discount capped at $30 per registration
Utilize this Academic Subsidy during the payment process to offset your final registration costs.

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Flash Discount

10% discount on the total fee.

LIMITED10

Hybrid Conference (In Person / Virtual)

International Conference on Thermal Conductivity and Material Engineering (ICTCME - 26)
23rd - 24th July 2026 , Hamburg, Germany
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Supporting Continuous Innovation

IIRD maintains uninterrupted academic processes despite the current global situation. Participants can share and publish their research through web-based and hybrid participation options.

Conference Notifications:

"Be sure to check this section regularly for all IIRD Global Conference updates. We’ll keep you informed about deadlines, event details, and more important notifications."

  • Abstract Submissions Open:
    "We are now accepting abstract submissions for the IIRD Global Conference in Hamburg. Submit your abstract by today to be part of this exciting international event." Call for Abstracts – Submit Now!
  • Paper Submission Guidelines:
    "Please ensure your paper follows the submission guidelines for smooth processing. Visit our paper submission page for more details."
  • Peer Review Process:
    "The peer review process will begin soon. Authors will receive valuable feedback that will help enhance their presentations for the Hamburg conference."
  • Networking with Global Experts:
    "Join global experts at our conference in Hamburg and engage in meaningful conversations. Build relationships that last." Register now to join!
  • Best Paper Presentation Award:
    Dr. Shatha Hawarna from Hamdan Bin Mohammed Smart University received the Best Paper Presentation Award at (ICBAI-25) in Bangkok, Thailand.
  • SDG-Inspired Conference Focus:
    "The conference will explore themes related to sustainability and inclusive development, with an emphasis on research that contributes to global well-being."

Call For Papers

The ICTCME provides a supportive platform for both experienced researchers and early-career academicians to present their work and gain recognition.

The conference covers diverse topics such as Heat Transfer, encouraging participation from emerging researchers and fostering academic growth.

Authors are invited to submit papers addressing, but not limited to, the following areas:

01
Thermal conductivity measurement techniques
02
Materials with high thermal conductivity
03
Thermal management in electronic devices
04
Nanostructured materials for heat transfer
05
Thermal conductivity of polymers
06
Innovative thermal insulation materials
07
Heat transfer in composite materials
08
Measurement of thermal properties
09
Thermal conductivity in biomaterials
10
Applications of thermal conductivity in industry
11
Modeling thermal conductivity in materials
12
Thermal conductivity in energy systems
13
Impact of temperature on material properties
14
Thermal conductivity in nanomaterials
15
Advanced characterization techniques
16
Thermal conductivity in construction materials
17
Thermal behavior of phase change materials
18
Thermal conductivity in metals and alloys
19
Emerging materials for thermal applications
20
Future directions in thermal conductivity research

Assessment

Submissions will be reviewed to ensure quality and relevance, with a focus on encouraging emerging research contributions. Accepted papers will be presented and considered for publication opportunities.

Registration

Early-career researchers are encouraged to register and present their work, gaining valuable feedback and academic exposure.

Publication

The conference provides opportunities for emerging researchers to publish their work in recognized platforms.

Submit Paper Before Deadline Register Now – Limited Slots
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